Power semiconductor for precise power control
Over the past 30 years, power semiconductors have almost completely replaced electromechanical solutions in drive applications and power transmission and distribution systems. StakPakTM, ABB's new power semiconductor packaging sets new standards in flexibility, performance and reliability. This innovation, developed by ABB's Corporate Research Center in Baden, Switzerland, was nominated for the prestigious Swiss Technology Award 2005, and it will be shown at the Swiss Technology Award organization's booth at the Hannover Messe (Hall 2, Booth A28).
Today's power distribution networks are very heavily loaded. The slightest disturbance can have catastrophic consequences when transmission bottlenecks occur. ABB has addressed this situation by developing new technologies that enable precise monitoring of power distribution network loads, in order to increase grid capacities in a stable manner. High voltage DC transmission systems (HVDC) and flexible AC transmission systems (FACTS) play a key role in achieving these objectives.
These two systems operate on the same basic principle: They dissect power flow into small packets in the millisecond range. FACTS systems stabilize the network by extracting these "energy packets" from the network at precisely the right instant, "parking" them at an intermediate storage location and then reinserting them at the ideal point in time. Low-loss HVDC systems are able to transmit these energy packets over long distances, enabling them to transport power in a very controlled way. The latest HVDC technology enables the installation of oil- and lead-free cable systems that have no negative environmental effects unlike their outdoor transmission line counterparts, such as electromagnetic fields or unsightly structures. In addition, HVDC systems help improve the efficiency of interfacing strongly fluctuating wind power systems with the existing grid.
First and foremost, StakPakTM makes it possible to slice power flows into individual "packets". Electronic switches made of silicon, which are fabricated in the same manner as computer chips, are the key components of the module. ABB utilizes the latest IGBT technology (Insulated Gate Bipolar Transistor) in the StakPakTM. A single ABB IGBT chip smaller than a eurocent coin is able to switch approximately 150 kW of electrical power on and off within a few microseconds. This corresponds to the power rating of the engine in an intermediate-size automobile. The control power required is only a few hundred milliwatts per chip.
Since StakPakTM is used for applications where power ratings are over one megawatt (even greater than 500 MW for some power technology applications), a large number of IGBT chips are interconnected. This requirement is addressed with a modular system design, where six IGBT chips are assembled on one building block, called a "submodule". One of these submodules is capable of switching about one megawatt. Up to six of these submodules are combined to form a StakPakTM module. The required system rating is then achieved by connecting a number of these StakPakTM modules in series. This concept enables a whole range of applications and different power ratings to be covered using a single basic module. The StakPakTM modules are simply stacked one on top of another when they need to be connected in series. A heat sink is installed between each pair of modules to dissipate the losses that arise during operation.
StakPakTM is designed to operate as a failsafe system; that means system availability is increased by including redundant modules. All components connected in series must fail to a short-circuit (low impedance) condition to ensure that the system will continue to operate. Not only does a special internal design guarantee such a failure mode (a type of reliable "self-healing") but it also enables continued operation of the system until the next scheduled maintenance - without reducing power or shutting the system down.
StakPakTM is designed for maximum operating life with utmost reliability. Accelerated life cycle tests have demonstrated that the design life in the target applications will be at least thirty years. Statistically, the module will operate an average of ten million hours between failures.
Today's power distribution networks are very heavily loaded. The slightest disturbance can have catastrophic consequences when transmission bottlenecks occur. ABB has addressed this situation by developing new technologies that enable precise monitoring of power distribution network loads, in order to increase grid capacities in a stable manner. High voltage DC transmission systems (HVDC) and flexible AC transmission systems (FACTS) play a key role in achieving these objectives.
These two systems operate on the same basic principle: They dissect power flow into small packets in the millisecond range. FACTS systems stabilize the network by extracting these "energy packets" from the network at precisely the right instant, "parking" them at an intermediate storage location and then reinserting them at the ideal point in time. Low-loss HVDC systems are able to transmit these energy packets over long distances, enabling them to transport power in a very controlled way. The latest HVDC technology enables the installation of oil- and lead-free cable systems that have no negative environmental effects unlike their outdoor transmission line counterparts, such as electromagnetic fields or unsightly structures. In addition, HVDC systems help improve the efficiency of interfacing strongly fluctuating wind power systems with the existing grid.
First and foremost, StakPakTM makes it possible to slice power flows into individual "packets". Electronic switches made of silicon, which are fabricated in the same manner as computer chips, are the key components of the module. ABB utilizes the latest IGBT technology (Insulated Gate Bipolar Transistor) in the StakPakTM. A single ABB IGBT chip smaller than a eurocent coin is able to switch approximately 150 kW of electrical power on and off within a few microseconds. This corresponds to the power rating of the engine in an intermediate-size automobile. The control power required is only a few hundred milliwatts per chip.
Since StakPakTM is used for applications where power ratings are over one megawatt (even greater than 500 MW for some power technology applications), a large number of IGBT chips are interconnected. This requirement is addressed with a modular system design, where six IGBT chips are assembled on one building block, called a "submodule". One of these submodules is capable of switching about one megawatt. Up to six of these submodules are combined to form a StakPakTM module. The required system rating is then achieved by connecting a number of these StakPakTM modules in series. This concept enables a whole range of applications and different power ratings to be covered using a single basic module. The StakPakTM modules are simply stacked one on top of another when they need to be connected in series. A heat sink is installed between each pair of modules to dissipate the losses that arise during operation.
StakPakTM is designed to operate as a failsafe system; that means system availability is increased by including redundant modules. All components connected in series must fail to a short-circuit (low impedance) condition to ensure that the system will continue to operate. Not only does a special internal design guarantee such a failure mode (a type of reliable "self-healing") but it also enables continued operation of the system until the next scheduled maintenance - without reducing power or shutting the system down.
StakPakTM is designed for maximum operating life with utmost reliability. Accelerated life cycle tests have demonstrated that the design life in the target applications will be at least thirty years. Statistically, the module will operate an average of ten million hours between failures.
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