11/12/2009 • Laboratory appliances • Microscopy / Imaging

Full Wafer DualBeam Solution

FEI Company announced the newest member of the Helios NanoLab Family the Helios 1200 Full Wafer DualBeam system. The ability of the Helios 1200 to analyze full wafers up to 300 mm improves the efficiency of semiconductor and data storage failure analysis and manufacturing support labs that need to deliver accurate data quickly to the production floor.

The Helios 1200 combines world-class scanning electron microscope (SEM) image resolution and extremely fast switching between imaging and ion beam milling to deliver rapid, reliable, efficient cross-sectional analysis of structures and defects. Its ability to accommodate full wafers up to 300 mm eliminates the time required to re-establish the navigational coordinate system when working with wafer pieces.

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FEI Technologies Inc.

Achtseweg Noord 5, Bldg AAE
5651 GG Eindhoven

Phone: +31 (0)40/2766-768
Fax: +31 (0)40/2766-786