10/07/2003 • Image processing / Optical metrology

Optical 3D Measurement in Microelectronics

The trend to ever-smaller structures in IC packaging for fine-pitch solder printing and in hybrid technology requires increasingly high-technology measurement techniques to capture, for example, bump co-planarity, contact roughness and the volume of printed solder paste or dispensed conductive adhesive. The optical scanning profilometer µScan, from NanoFocus, facilitates these tasks
quickly, non-destructively and with high precision in the
laboratory and also on the production floor. A feature worthy
of special notice is the introduction of a new confocal sensor
head with which measurements such as the depth of
microvias to 1 micron precision can be made, while also
capturing the warp of the PCB in millimetric ranges. All
measurement tasks can easily be automated, considerably
simplifying operation, and process data can be evaluated
statistically.

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NanoFocus AG

Max-Planck-Ring 48
46049 Oberhausen

Phone: +49/(0)208/62000-0
Fax: +49/(0)208/62000-99