microme|x automatic X-ray inspection at ist best.
On the occasion of Productronica 2005 phoenix|x-ray will be presenting a world premiere the new highly resolving X-ray inspections system microme|x.
A novelty to the industry phoenix|x-ray has developed a system that combines all features for an optimum comprehensive inspection of printed circuit board assemblies. The microme|x disposes of an extra large scanning area of 20" x 24", a highly precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. The special value is the combination of these characteristics – for the first time the operator can now inspect large boards with mixed assemblies and acquire real-time oblique views under all angles (0-360°). A typical inspection task could be the analysis of the solder joint pad wetting quality of a centrally placed BGA.
Another outstanding characteristic of the microme|x is the board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the new inspection software XE? it is thus possible to perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. In this way multiple inspection tasks can be executed and repeated in an easy, reliable und time-saving manner. An interface for the CAD-data import allows using the original PCB layout in order to teach in the inspection routine. The inspection reports can be transferred to a rework station by means of the repair programme quality|review and thus badly soldered devices can easily be found and replaced or reworked. The SPC* module (*Statistical Process Control) allows the statistical evaluation of the inspection results and the process supervision.
The system possesses over an open microfocus tube with a non-toxic target and over a fully digital image chain with up to 4 Megapixels for a resolution < 1µ and highest image quality, best inspection results guaranteed also for lead-free solder joints.
Different security features, such as the anti-collision system and the low-dose|mode for radiation dose minimisation are dedicated for maximum safety of sensitive samples.
The microme|x has been engineered in accordance with ergonomic measures and the design follows the standards of modern industrial design. The system like all phoenix|x-ray systems comes in a radiation safe cabinet and ready-to-operate for instant use in production or laboratory.
The System will be displayed at Productronica 2005 – Hall A2, Stand 277
A novelty to the industry phoenix|x-ray has developed a system that combines all features for an optimum comprehensive inspection of printed circuit board assemblies. The microme|x disposes of an extra large scanning area of 20" x 24", a highly precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. The special value is the combination of these characteristics – for the first time the operator can now inspect large boards with mixed assemblies and acquire real-time oblique views under all angles (0-360°). A typical inspection task could be the analysis of the solder joint pad wetting quality of a centrally placed BGA.
Another outstanding characteristic of the microme|x is the board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the new inspection software XE? it is thus possible to perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. In this way multiple inspection tasks can be executed and repeated in an easy, reliable und time-saving manner. An interface for the CAD-data import allows using the original PCB layout in order to teach in the inspection routine. The inspection reports can be transferred to a rework station by means of the repair programme quality|review and thus badly soldered devices can easily be found and replaced or reworked. The SPC* module (*Statistical Process Control) allows the statistical evaluation of the inspection results and the process supervision.
The system possesses over an open microfocus tube with a non-toxic target and over a fully digital image chain with up to 4 Megapixels for a resolution < 1µ and highest image quality, best inspection results guaranteed also for lead-free solder joints.
Different security features, such as the anti-collision system and the low-dose|mode for radiation dose minimisation are dedicated for maximum safety of sensitive samples.
The microme|x has been engineered in accordance with ergonomic measures and the design follows the standards of modern industrial design. The system like all phoenix|x-ray systems comes in a radiation safe cabinet and ready-to-operate for instant use in production or laboratory.
The System will be displayed at Productronica 2005 – Hall A2, Stand 277
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