The Flying Spot Scanner (FSS) provides spectral interferometric measurements for thickness and topography based on technology that enables high-speed, non-contact inspection for quality assurance for many materials and surfaces. The FSS310 version is expected to fundamentally change the semiconductor market. The 310-mm scanning area allows a 12-inch diameter wafer to be fully inspected for TTV, warpage and deformation in 10 seconds. The moving mirror system replaces long travels of linear axes with short rotary motions, greatly reducing measurement time.