The THT Line 3D from Göpel Electronic is an inspection system for double-sided, parallel inspection of electronic assemblies with SMD and THT components. In the current generation, a double-sided inspection in 3D is now possible. The THT Line 3D can thus inspect the top and bottom of the assembly simultaneously in 3D. This is made possible by an additional 3D AOI module in the system. This makes it possible, for example, to inspect selective solder joints on both sides of the assembly simultaneously while measuring the solder volume and pin length using the 3D method. With a component clearance of 140 mm, even large components can be inspected. The 3D measuring height is a maximum of 40 mm.