Low Speed Diamond Saw for Sample Preparation

Agar Scientific announced the availability of the new Labcut 150 low speed diamond saw for sample preparation. The low speed diamond saw is well established in materials laboratories for cutting and sectioning a wide variety of small and delicate samples particularly when the material structure is not homogeneous. It gives a high quality cut surface without serious deformation and with minimum burr.

The design uses thin diamond/CBN bonded wafering blades to cut fragile and soft samples that cannot be handled by high speed abrasive/diamond cutting machines. A range of sample holders have also been designed for this purpose including a rotating holder for round materials. The speed of the wafering blades can be varied between 0 and 1000rpm for optimum cutting conditions.