New sensors for inclination, acceleration and vibration

The sensors are based one an advanced "bulk micro machined" MEMS  technology. The three dimensional structure (3D MEMS) of these sensors  comprise a pendulum made of mono crystalline silicon. The pendulum is  hermetically enclosed between two silicon discs. From this construction  results a long term stable, high resolution und shock resistant sensor.
A gas damping prevents overshooting and interfering resonance  oscillation. The movement of the pendulum is measured capacitive by an ASIC. The sensors are mounted in a small, solid brass housing with fixing wholes. The output signal has a large span of 0,5 to 4,5 VDC over the measuring  range. The power supply requirements are 5VDC or 7 -- 35 VDC.
 

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