Ultra-High-Resolution Analysis

Following the success of its Expida 1255 wafer DualBeam system for semiconductor labs, FEI Company has introduced the next-generation tool in the product family, the Expida 1255S. It is the first, and only, wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. It features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging. The system assures correct end-pointing and precise lamella thickness by enabling STEM imaging while milling the TEM sample to its final location and required thickness. It uniquely addresses the requirements of high-throughput STEM imaging and analysis for sub-45 nanometer process control.