3D sensor solution 3D Profile Unit
Laser thickness-measurement in production-line
ThicknessControl is a family of thickness measurement systems from Micro-Epsilon based on high precision non-contact displacement measurement systems. The mechatronic measurement devices consist of a precision mechanical system, an innovative sensor section and modular evaluation and control software.
The Series 8315 is a measurement system for the in-line thickness measurement of non-transparent boards and webs. These include, for example, chipboards, mineral boards, glass-fiber composite boards, foam webs, etc. These measurement systems are used directly on the production line for quality assurance and process control.
The Series 8315 uses a laser-based optical displacement sensor with a very large offset distance to the product to be measured in order to permit the largest possible throughput aperture for the material web. Thus high process reliability is also ensured. The measurement is carried out from one side against the web or board material. The other side of the product is located on a reference surface which is measured before the start of production and saved as a calibration.
The mechanical basis of the measurement system is formed by an integrated compensation frame which does not vary with temperature. This is designed such that in conjunction with efficient algorithms a measurement gap is produced which is independent of temperature variations and mechanical distortion.
The measurement system can be rated for traversing widths of up to 6,000 mm and traversing speeds of up to 0.2 m/s. With the laser displacement sensors from Micro-Epsilon measuring rates of up to 5 kHz are possible with resolutions down to below one micrometer. The thickness measurement range can be up to 50 mm.
In its Systems Division Micro-Epsilon carries out development and production of complex automatic measurement systems for process monitoring and quality control. All mechatronic components (sensors, electronics, mechanical parts and software) are developed and produced within Micro-Epsilon. A wide range of precision displacement sensors operating on the most varied physical principles is available for the solution of difficult and awkward measurement tasks.
The Series 8315 is a measurement system for the in-line thickness measurement of non-transparent boards and webs. These include, for example, chipboards, mineral boards, glass-fiber composite boards, foam webs, etc. These measurement systems are used directly on the production line for quality assurance and process control.
The Series 8315 uses a laser-based optical displacement sensor with a very large offset distance to the product to be measured in order to permit the largest possible throughput aperture for the material web. Thus high process reliability is also ensured. The measurement is carried out from one side against the web or board material. The other side of the product is located on a reference surface which is measured before the start of production and saved as a calibration.
The mechanical basis of the measurement system is formed by an integrated compensation frame which does not vary with temperature. This is designed such that in conjunction with efficient algorithms a measurement gap is produced which is independent of temperature variations and mechanical distortion.
The measurement system can be rated for traversing widths of up to 6,000 mm and traversing speeds of up to 0.2 m/s. With the laser displacement sensors from Micro-Epsilon measuring rates of up to 5 kHz are possible with resolutions down to below one micrometer. The thickness measurement range can be up to 50 mm.
In its Systems Division Micro-Epsilon carries out development and production of complex automatic measurement systems for process monitoring and quality control. All mechatronic components (sensors, electronics, mechanical parts and software) are developed and produced within Micro-Epsilon. A wide range of precision displacement sensors operating on the most varied physical principles is available for the solution of difficult and awkward measurement tasks.
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